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纳米结构硬质合金磨削的表面形貌和材料去除机理研究

Surface Morphology and Material-removal Mechanism in Grinding of Nanostructured Tungsten Carbide

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【作者】 任莹晖张璧周志雄

【Author】 Ren Yinghui1 Zhang Bi1,2 Zhou Zhixiong1 1.Hunan University,Changsha,410082 2.The University of Connecticut,Storrs,CT06269-3139,USA

【机构】 湖南大学美国康涅狄格大学

【摘要】 在使用金刚石砂轮的精密平面磨床上进行纳米结构硬质合金的磨削实验研究,通过扫描电子显微镜观察磨削表面形貌,利用表面轮廓仪测量磨削表面粗糙度。分析金刚石砂轮粒度和结合剂类型、设定切深和工作台进给速度对表面质量的影响,讨论磨削过程中材料的去除机理。研究结果表明:表面粗糙度随单颗磨粒最大未变形切屑厚度单调递增;在相同砂轮设定切深条件下,砂轮粒度影响表面粗糙度;树脂砂轮更适宜磨削纳米结构硬质合金;材料主要以非弹性变形方式去除。

【Abstract】 This study conducted surface grinding on nanostructured tungsten carbide by diamond wheel under various grinding conditions.Ground workpiece surfaces were observed and measured by scanning electron microscopy and surface profilometry.The study investigated material-removal mechanism and the effect of grinding process parameters,such as grit size and bond type of the diamond wheel,as well as set depth of cut and workpiece feedrate,upon workpiece surface morphology.The study demonstrates that the surface roughness increases with the increasing maximum undeformed chip thickness,and is affected by the grit size of the wheel at the same wheel depth of cut;the wheel with resin bond is more appropriate for grinding the nanostructured tungsten carbide;and material removal is accomplished mainly through inelastic deformation.

【基金】 国家自然科学基金资助项目(50275051)
  • 【文献出处】 中国机械工程 ,China Mechanical Engineering(中国机械工程) , 编辑部邮箱 ,2009年08期
  • 【分类号】TG580.6
  • 【被引频次】15
  • 【下载频次】407
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