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含铜低温热轧取向硅钢初次再结晶组织研究
Primary recrystallization microstructure of low temperature hot roll oriented silicon steel bearing copper
【摘要】 为研究含铜低温热轧取向硅钢再结晶组织,采用3种不同的初次再结晶退火工艺进行热处理。结果表明,脱碳退火前的高温退火工艺有助于增加硅钢初次再结晶组织中20°~45°晶界比率;采用渗氮工艺,可在大幅提高∑5晶界比率的同时增大晶粒尺寸。应用晶粒尺寸阈值公式计算出的初次晶粒大小约为8μm,计算结果与试验数据相符。
【Abstract】 Three different heating methods have been used for the study of low temperature hot roll oriented silicon steel bearing copper.The results show that: high temperature heating prior to decarburization annealing can improve the proportion of 20°~45° boundaries in the primary recrystallization microstructure;nitriding process can significantly improve the proportion of ∑5 boundaries and increase the grain size.Calculation shows that the primary recrystallization grain size is about 8 μm by the critical grain size formula,which is consistent with the experimental data.
【Key words】 oriented silicon steel bearing copper; grain size; misorientation; CSL;
- 【文献出处】 武汉科技大学学报 ,Journal of Wuhan University of Science and Technology , 编辑部邮箱 ,2009年06期
- 【分类号】TG335.11
- 【被引频次】5
- 【下载频次】287