【摘要】 以作者课题组近期的研究结果为基础,以集成电路中互连线用金属Cu薄膜为模型材料,分别介绍了金属薄膜延性和疲劳寿命评价方法及相关测试结果的最新进展,讨论了介观尺度Cu薄膜力学性能的尺度效应,分析了薄膜材料中准静态力学性能对动态性能的影响,并简述了多场耦合对薄膜力学性能及变形行为的影响。更多还原

【Abstract】 Based on the recent experimental results achieved in the present authors’ group,this paper presents a review on the evaluation methods and some measurement results of the ductility and fatigue lifetime of metal films.Measurements on mesoscale Cu films have been performed and the size-dependent mechanical properties,including yield strength,the critical strain for microcrack nucleation,and related fatigue lifetime,have been clearly revealed.The relationship between the quasi-static mechanical properties and the dynamic properties has been analyzed within the thickness range from miron-scale to nano-scale.In addition,the influence of thermo-mechanical coupling field on the mechanical properties and deformation behavior of the Cu films has been also briefly discussed.更多还原