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Mechanism of Strength Loss of No-bake Phosphate Bonded Sand Mold/Core

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【作者】 张友寿

【Author】 ZHANG Youshou1, 2, XUE Yiyu1, HUANG Jin2, LI Sinian2, XIA Lu2, HUANG Caihua1 (1. School of Automobile Engineering, Wuhan University of Technology, Wuhan 430074, China; 2. School of Mechanical Engineering, Hubei University of Technology, Wuhan 430068, China)

【机构】 School of Automobile Engineering,Wuhan University of TechnologySchool of Mechanical Engineering,Hubei University of Technology

【摘要】 The strength loss mechanism of the phosphate bonded sand mold/core was studied. The morphology and composition of phosphate membrane on the surface of sands was analyzed with electron probe X-ray microanalyzer. Results show that magnesium causes cracks in cured phosphate membrane and results in the decrease of sand molds/cores strength. However, the addition of magne-sium significantly enhanced hygroscopy resistance of phosphate membrane. In addition, the phosphate binder added with the magnesium modifier has more rapid hardening reaction speed compared that without or with low magnesium binder. It can be concluded that the phosphate binder with the addition of magnesium modifier is favorably used in high humid and cold circumstance.

【Abstract】 The strength loss mechanism of the phosphate bonded sand mold/core was studied. The morphology and composition of phosphate membrane on the surface of sands was analyzed with electron probe X-ray microanalyzer. Results show that magnesium causes cracks in cured phosphate membrane and results in the decrease of sand molds/cores strength. However, the addition of magne-sium significantly enhanced hygroscopy resistance of phosphate membrane. In addition, the phosphate binder added with the magnesium modifier has more rapid hardening reaction speed compared that without or with low magnesium binder. It can be concluded that the phosphate binder with the addition of magnesium modifier is favorably used in high humid and cold circumstance.

【基金】 Funded by the Natural Science Foundation of Hubei Province (No. 2005ABA056)
  • 【文献出处】 Journal of Wuhan University of Technology(Materials Science Edition) ,武汉理工大学学报(材料科学版)(英文版) , 编辑部邮箱 ,2009年01期
  • 【分类号】TG22
  • 【被引频次】1
  • 【下载频次】51
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