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急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究
Study on Soldering Procedure and Joint Properties of Down Quenching SnAgCu Solder Alloy
【摘要】 制备了急冷型SnAgCu系钎料合金,在对其进行熔化特性测定和钎焊工艺试验后,对钎焊接头的力学性能和显微组织进行了测试分析,结果表明:所制备钎料合金的熔化特性满足要求;钎焊温度和钎焊时间对接头的剪切强度有较大影响,工艺参数为275℃×4.5min时,接头强度最高;在钎焊过程中形成的金属间化合物沿界面分布不均匀,且向钎焊缝中生长。
【Abstract】 Down quenching SnAgCu solder alloy was prepared.The mechanical properties and microstructure of the joints were tested and analyzed after testing the melting properties and soldering procedure.The results show that the melting properties of the solder alloy are satisfactory,and the soldering temperature and time have much effect on the shearing-strength of the joints.When the procedure is 275℃×4.5 min,the strength of the joint is highest.The IMC formed during the soldering process have uneven distributions,and they grow towards the soldering seam.
【Key words】 down quenching; SnAgCu; melting property; soldering temperature; soldering time; IMC;
- 【文献出处】 热加工工艺 ,Hot Working Technology , 编辑部邮箱 ,2009年05期
- 【分类号】TG425
- 【被引频次】2
- 【下载频次】104