【摘要】 为了防止陶瓷壳体中的电路和底部的热敏感微器件的高温损坏,应用高频感应局部加热技术实现陶瓷壳体气密封装.5s内,焊料环和可伐盖板上的涡电流产生的热量使温度升高至约320℃,由于热传导,此时陶瓷壳体的底部区域温度约100℃.采用红外热像仪、氦质谱检测仪、六轴测试仪和三维显微镜,分别对陶瓷封装过程中的局部温度变化、温度分布、气密性、封装强度和封装断面进行了检测和分析.结果表明,感应局部加热的效果良好,封装的陶瓷壳体有较好气密性;封装壳体的拉伸强度从4.0MPa到16.0MPa,与封装压力和感应加热时间相关;断面的分析表明过长的加热时间导致焊料的外溢.更多还原

【Abstract】 In order to protect the circuit in package and the thermal-sensitive devices at the bottom of the ceramic crust from high-temperature damage,high frequency localized induction heating technology was applied to packaging the ceramic crust.It took only about 5 s to complete the packaging process.The temperatures on the cover edges near the solder-loop and at the bottom of the ceramic package were about 320 ℃ and 100 ℃,respectively.The local temperature variation,temperature distribution,hermetic test,tensile strength and fracture analysis in this packaging process were tested and evaluated by infrared thermal imager,helium mass spectrometry detector,six-axis tester and three-dimensional microscope.Results show that due to the solder reflow,hermetic seal of the ceramic package is accomplished.In addition,a tensile strength in the range of 4.0 MPa—16.0 MPa is achieved,which depends on the induction heating time and packaging pressure.Finally,longer heating time will lead to the overflow of the solder.更多还原