【摘要】 采用同基合金电弧离子镀方法,在紫铜基体上制备了Cu-Ti合金薄膜,研究了弧电流和靶-基距离对膜层质量、沉积速率的影响。结果表明,镀层沉积速率随着弧电流的增加而增大,随靶-基距离的增大而下降;镀层近表面为层片状组织,镀层表面有颗粒存在,显示电弧源后期喷射的是Cu-Ti合金液滴;近界面处,组织细密,晶粒较小。镀层由沉积层和过渡层构成,Ti含量由表至里逐渐降低,过渡层的存在有利于提高膜-基结合力。镀层显微硬度呈梯度分布,表面显微硬度约为铜基材的3倍。更多还原

【Abstract】 The layer of Cu-Ti alloy was prepared by arc ion plating(AIP) on the copper substrate.The effects of arc current and the distance between the substrate and the target on the quality of the layer and deposited rate were studied.The results show that the deposition rate increases with increasing of the arc current,and decreases with increaseing of the distance between the substrate and the target.The section morphology of the deposited layer is in the form of laminate near the surface,and some granular-crystallines present on the layer′s surface.It indicates that the Cu-Ti alloy droplets are ejected from the target during later period.The microstructure is compact and the grain size is small near the interface.The layer is composed of transition layer and the deposited layer,whose content of Ti decreases gradually from the surface to the inside.The presence of the transition layer is in favor of advancing the binding force between the layer and the substrate.The micro-hardness distribution of the deposition layer is presented in gradient form,whose hardness value at the surface is about 3 times as that of the substrate.更多还原