【摘要】 芯片封装技术在芯片制造中占有非常重要的地位,而引线键合又占到芯片封装的90%以上。对热超声引线键合系统进行介绍,描述了引线键合系统各部分常用的计算理论基础,采用ANSYS9.0有限元软件建立了63kHz热超声引线键合换能器的有限元模型,计算得到了63kHz引线键合换能器在工作频率附近的模态,通过阻抗测试和振动测试,证实引线键合换能系统在工作时,工作模态和非工作模态都被激发,验证了有限元模态分析的正确性,也证明了有限元方法在引线键合系统分析过程中是有效的。更多还原

【Abstract】 The chip package has an important position in chip manufacturing,and wire bonding accounts for 90% of chip package.A wire bonding system is introduced,and calculation theory principle of wire bonding is presented.A model of 63 kHz wire bonding transducer is built utilizing finite element method.The mode around work frequency is calculated.Impedance test and vibration test show that both the work mode and non-work mode are excitated during working,which validates the correctness of finite mode analysis.It is proved that the finite element method is valid in wire bonding system.更多还原