【摘要】 采用简化的内氧化工艺制备了Al2O3/Cu复合材料,研究不同内氧化时间(3～10h)及不同变形量(20%～80%)下的Al2O3/Cu复合材料的显微硬度和导电率,并对其显微组织进行了分析。结果表明:内氧化法制备的Al2O3/Cu复合材料中弥散分布着纳米级的Al2O3颗粒;复合材料的表面和内部的晶粒大小明显不同,表面晶粒较小(粒径10～30μm);冷加工变形量越大,Al2O3颗粒与位错的缠结越严重;经900℃内氧化制备的Al2O3/Cu复合材料具有良好的导电率和显微硬度。更多还原

【Abstract】 Al₂O₃/Cu composites were prepared by internal oxidation of Cu-Al alloy.The microstructure,microhardness and electrical conductivity of the Al₂O₃/Cu composites prepared with different internal oxidation time and deformation were examined.The results show that Al₂O₃ nano-particles disperse in the Al₂O₃/Cu composites after internal oxidation of Cu-Al alloy.The sizes of grains are obviously different in surface layer compared with inside,the grain size of surface layer is smaller（about 10～30μm）.With increasing of deformation,density of dislocations increases in the Al₂O₃/Cu sheets.Al₂O₃/Cu composites prepared by internal oxidation of Cu-Al alloy at 900℃ have excellent electrical conductivity and high microhardness.更多还原