【摘要】 多物理场耦合有限元方法被用来模拟光抽运垂直外腔面发射半导体激光器(OPS-VECSEL)内部的热分布情况,特别对OPS-VECSEL芯片帽层表面与金刚石散热片毛细键合(capillary bond)的情况做了计算。计算表明,在没有金刚石散热片的情况下,从窗口以下首个量子阱到末个量子阱的温差达到150 K;在有金刚石散热片的情况下,器件中各个量子阱的温差很小,其共振波长差只有几纳米;在芯片的分布式布拉格反射镜(DBR)一侧焊接有硅微通道冷却器的情况下,各量子阱间的温差进一步减小,器件性能得到最大改善。模拟计算也表明,在抽运功率不变的情况下,适当增加抽运光的半径,可显著降低器件的热效应,尤其热透镜效应。更多还原

【Abstract】 Multiphysics finite element analysis was used to simulate the heat distribution in a optical pumping semiconductor vertical-external-cavity surface-emitting laser(OPS-VECSEL).Specially,the VECSEL with a plate of transparent diamond that capillary bond to on cap layer of chip was calculated.Calculation indicate that when there is no diamond piece,the temperature difference between first and the last quantum well is about 150 K.But when the cooler is present,the temperature difference between them is very small as well as the resonale wavelongth difference.In addition to diamond piece,a silicon microchannel cooler soldered onto DBR side of chip ulteriorly decreases the temperature difference between quantum wells and optimizes character of the chip.Simulating calculation also shows that properly increasing the diameter of pumping optical speckle was obviously able to lower the thermal effect,specially the heat lens effect.更多还原