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利用热分析对导电胶进行组分分析的研究

Study on the Compositions of Conductive Paste by Thermal Analysis

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【作者】 句红兵李妹明赵鹤云

【Author】 JU Hong-bing1,LI Mei-ming1and ZHAO He-yun2(1.Yunnan Opto-electro Auxiliary Materials Co.Ltd.,Kunming 650114,China;2.Department of Materials Science and Engineering,Yunnan University,Kunming 650091,China)

【机构】 云南光电辅料有限公司云南大学材料科学与工程系

【摘要】 为了分析一种导电胶的成分,利用热分析仪采用一次投样两次测试的方法,对导电胶进行DSC-TGA测试分析。通过对两次DSC-TGA测试曲线的分析、比对、计算及样品感观鉴别,排除有机物的干扰,半定量判定样品的化学成分及用量。得出此胶由无机物及有机物组成,其配比如下:二乙二醇甲醚约20%,乙基纤维素及其它未知有机物约1%,铝粉约40%,银粉约20%,低熔点玻璃粉及其它未知无机物约20%。此工作为利用热分析简便、快捷分析胶黏剂组分提供了一条新思路。

【Abstract】 In order to analyze the compositions of a conductive paste,the sample was tested twice by the DSC-TGA thermal analysis in the thermal analysis instrument.The two DSC-TGA curves were analyzed,calculated and contrasted.The second DSC-TGA curves gave further information with the organic matter was burned down in the first test.The semi-quantitative compositions of the sample were got.It is found that the conductive paste contains organic and inorganic matter,and the approximate compositions are di-ethylene glycol mono-methyl ether is 20%,ethyl cellulose and other unknown organic matters are 1%,aluminum powder is 40%,silver powder is 20% and the glass powder and other unknown inorganic matters are 20%.

【关键词】 热分析胶黏剂组分分析
【Key words】 Thermal analysisadhesivecompositionsanalysis
  • 【文献出处】 化学与粘合 ,Chemistry and Adhesion , 编辑部邮箱 ,2009年03期
  • 【分类号】TQ430.7
  • 【被引频次】1
  • 【下载频次】285
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