【摘要】 首次将有机金属盐辛酸亚锡作为活性组分替代现有技术中一般采用的无机金属氟硼酸盐,研发出新型铝用无铅低温软钎剂,并通过对照试验和扩展性能、XRD、SEM及EDS等测试,研究其对铝钎焊的助焊性能。结果表明:所得钎剂能很好地实现铝的无铅低温软钎焊,并在节能、环保、吸潮、稳定以及润湿铺展等性能方面显著地优于传统的有机型铝用软钎剂。同时,辛酸亚锡中的Sn2+被Al置换后能达到铝板200μm左右深处,从而有望解决因Sn-Al之间几乎不发生相反应而造成的接头强度不够、焊点易脱落问题,为铝的无铅低温软钎焊和铝在电子产品中的应用提供了新思路。更多还原

【Abstract】 An organic-metal soldering flux with lead-free and low temperature for aluminum was prepared. The testing results of soldering properties,XRD,SEM and EDS showed that the soldering flux could be achieved at low temperature soldering with lead-free solder for aluminum. This kind of soldering flux obviously surpassed the traditional organic flux for aluminum in energy conservation,environmental protection,absorption of moisture,stability,spreadability,and so on. At the same time,the replaced tin could achieve the aluminum sheet about 200 μm depth;it made the phase reaction possible between Sn and Al,and it also compensated the shortcoming in undercapacity and easy to fall off. This opened new ways of low temperature lead-free soldering aluminum and the applications of aluminum in electronic products.更多还原