【摘要】 电迁移过程中,焊点正负极处会分别出现"小丘"、"凹谷",空洞和裂纹等缺陷,这一系列显微组织的变化将对其电导率的变化有显著的影响。文中采用基于LabVIEWTM虚拟仪器的方法,搭建了应用于电迁移试验的电压信号采集系统,并将其应用于共晶SnBi焊点在电迁移试验过程中的数据采集试验。试验结果表明:电迁移数据采集系统具有实时性、高精度、高采样速率,并能够远程操控等优点;电迁移过程中,共晶SnBi焊点的电导率变化与电迁移试验的环境温度以及焊点内部显微组织的变化有关。更多还原

【Abstract】 Conductivity of electronic interconnects made with lead-free solders undergo a significant amount of deterioration in service.With the electromigration impact,the metal atoms/ions migrated towards the direction of electron flow.Such mass movement will induce electrical conductivity changes at different stages of electromigration.A LabVIEWTM controlled software was programmed to quantitatively measure the instantaneous electrical conductivity values after the electrical current was applied.The current study investigates the roles of different parameters, such as back stress,ambient temperatures on the deterioration of resistance during the electriomigration process.更多还原