High packing density laser diode stack arrays using Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks

【摘要】 A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks.The microchannel cooling technology leads to a 10-bar laser diode stack array having the thermal resistance of 0.199 °C/W,and enables the device to be operated under continuous-wave(CW) condition at an output power of 1200 W.The thickness of the discrete copper heatsink is only 1.5 mm,which results in a high packing density and a small bar pitch of 1.8 mm.更多还原

【Abstract】 A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks.The microchannel cooling technology leads to a 10-bar laser diode stack array having the thermal resistance of 0.199 °C/W,and enables the device to be operated under continuous-wave(CW) condition at an output power of 1200 W.The thickness of the discrete copper heatsink is only 1.5 mm,which results in a high packing density and a small bar pitch of 1.8 mm.更多还原