【摘要】 采用一种新的制造工艺,制备了Sn-0.65CuX(X为Ga、In、Bi、Ge、Sb、Ni、P、Re等掺杂元素)亚共晶改性钎料,研究了液态钎料在265℃温度下的抗氧化性、润湿性和漫流性。结果表明,原子掺杂与亚共晶的成分设计可以显著改善液态钎料的工艺性能,并延长钎料在使用条件下成分和性能的稳定性。在265℃大气气氛下,液态Sn-0.65CuX改性钎料表面氧化渣的生成速率仅为0.38mg/cm2.min;当采用RMA-flux钎剂时,在铜表面的润湿时间为0.88s,3s润湿力为0.79mN,扩展率为77.5%。更多还原

【Abstract】 Sn-0.65CuX hypoeutectic solder was prepared by using a new method.There,X is some doping element,such as Ga,In,Bi,Ge,Sb,Ni,P,Re etc.The oxid-resistance,wettability and spread ability of the liquid solder at 265℃ were studied.The results show that atomics doping and the hypoeutectic component design can significantly improve the processing properties of the liquid solder,and extend the stability of the solder in the using process.In the atmosphere at 265℃,the formation rate of oxide slag in liquid solder surface is only 0.38mg/cm2·min;when using RMA-flux,wetting time t0 on the surface of copper is 0.88s,F3 is 0.79mN,and spread rate is 77.5 percent.更多还原