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纳米AlN/EP导热绝缘胶的制备及其性能研究

Study on preparation and properties of Nano-AlN/EP thermally conductive insulating adhesive

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【作者】 时雯冯欣施利毅朱惟德

【Author】 SHI Wen1,FENG Xin3,SHI Li-yi2,3,ZHU Wei-de1(1.School of Material Science and Engineering,Shanghai University,Shanghai 200444,China;2.School of Science,Shanghai University,Shanghai 200444,China;3.Center of Nano Science and Technology,Shanghai University,Shanghai 200444,China)

【机构】 上海大学材料科学与工程学院上海大学纳米科学与技术研究中心上海大学理学院

【摘要】 采用纳米AlN作为导热填料,经硅烷偶联剂KH-570表面改性后与环氧树脂(EP)共混制备了导热绝缘胶。通过红外光谱(FT-IR)、接触角方法对改性后纳米AlN进行分析和表征,结果表明,KH-570成功包覆到了纳米AlN表面,粉体由亲水性变为疏水性;对于纳米AlN/EP导热绝缘胶,随着改性纳米AlN填充量的增加,导热率呈上升趋势;当KH-570用量为3.5%、纳米AlN量为20%时,导热率达到0.632W/(m.K),是纯环氧树脂胶的3倍多;此时体积电阻率为2.6×1013Ω.cm,剪切冲击强度为11.9×1015J/m2。

【Abstract】 With silicane coupling agent of KH-570 modified nano-AlN as thermal conductive filler,thermally conductive insulating adhesive based on epoxy resin was prepared by means of blending.The modified nano-AlN particles were characterized by FT-IR,contact angle respectively.The results showed that the KH-570 was successfully grafted to the surface of nano-AlN by the chemical bond,the surface changed from hydrophilicity to hydrophobicity was improved simultaneously.Thermal conductivity of the nano-AlN/EP adhesive increased with the increase of nano-AlN content.When the mass fraction of KH-570 was 3.5%,simultaneity when the mass fraction of nano-AlN was 20%,the thermal conductivity of the nano-AlN/EP adhesive were up to 0.632W/(m·K) higher 3 times than the pure EP adhesive.Its volume resistance and impact shear strength could reach 2.6×1013Ω and 11.9×1015J/m2 respectively.

【基金】 上海市科委技术创新团队资助项目(06DZ05902);上海市科委学科带头人计划资助项目(07XD14014);上海市教委第5期重点学科资助项目(J50102)
  • 【文献出处】 功能材料 ,Journal of Functional Materials , 编辑部邮箱 ,2009年03期
  • 【分类号】TQ436
  • 【被引频次】16
  • 【下载频次】618
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