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工程陶瓷的磨削钻孔及表面形成机理
Drilling and forming mechanisms of ground surfaces in engineering ceramics
【摘要】 结合工程陶瓷的加工特性,采用特定组份的铜基结合剂烧结金刚石钻头对其进行孔加工试验研究。结合剂体积分数为48%Cu、30%Co、6%N i、5%WC、5%Ti、4%Sn、2%Cr。根据烧结金刚石钻头的磨削加工特点,导出了唇面单颗金刚石磨粒的平均载荷的计算公式;在此基础上,结合陶瓷磨削表面的扫描电镜观察,分析了金刚石钻头磨削钻孔的陶瓷材料去除机理。结果表明,在试验条件下,陶瓷材料虽然以脆性断裂去除为主,但也有部分材料发生塑性变形去除。
【Abstract】 The specially sintered diamond bits were developed for drilling engineering ceramics with composition(vol%) of bond matrix being 48% Cu,30% Co,6% Ni,5% WC,5% Ti,4% Sn and 2% Cr.In view of the abrasive machining characteristics,the calculation expression of mean load per diamond on the lip face were set up,and accordingly the forming mechanism of ceramic ground surface was presented.Through SEM observations of ceramic ground surfaces,the material removal mechanisms were analyzed and verified.The results show that most of ceramic ground surfaces are formed through brittle fracture and few through ductile deformation.
【Key words】 engineering ceramics; sintering diamond bit; drilling process; surface forming mechanism;
- 【文献出处】 粉末冶金技术 ,Powder Metallurgy Technology , 编辑部邮箱 ,2009年05期
- 【分类号】TG580.6
- 【被引频次】6
- 【下载频次】219