【摘要】 该文研究用ANSYS软件对电子线路板做热可靠性分析时的建模问题,通过仿真分析,得到如下两点推论:(1)铜箔分布的不均匀性对PCB传热有重要的引导作用,因此在建模时应尽量予以考虑;(2)内部到外部热阻小的发热元件可以当作简单方块来处理,这样就使整板的建模大大简化。根据以上推论对一种新型星载电子线路板进行了ANSYS建模和计算,并把计算的结果与实验测试数据进行比较分析,验证了这种简化建模方法具有足够的准确性,使用方便,可以应用于星载及真空等环境中各种电子线路板的热可靠性分析研究。更多还原

【Abstract】 In this article, the ANSYS modeling problem of PCB thermal reliability analysis is studied. By ANSYS analysis, two conclusions can be drawn: (1) Copper lead on PCB has significant thermal transmission effect, so it should not be omitted in modeling. (2) Component with little inner to exterior thermal resistance can be modeling as a simple block. Based on these conclusions, the ANSYS modeling of a satelliteborne PCB equipment is largely simplified. Compared the ANSYS calculation results with experiment datas, it is proved that the simplified modeling method achieves adequate precision and is very convenience to use. This technique can be adopted in the thermal reliability analysis of PCB equipments , especially for satelliteborne or vacuum environments.更多还原