【摘要】 在采用功率芯片集成产品时,往往要求热阻小,可靠性高。在这方面,真空共晶技术与传统的芯片贴装方法如环氧粘结或者手动氮气保护共晶技术相比更具优势。分析了真空环境对共晶焊接的影响,同时对影响真空共晶焊接的工艺因素进行了剖析,通过这些因素的控制,可以得到无空洞的焊接。同时给出了真空共晶技术可能的应用。更多还原

【Abstract】 Low heat resistance and high reliability are the base requirements for power integrated products.Compared with epoxy die attach and nitrogen environment manual eutectic technologies,vacuum brazing have more superiorities.Vacuum affecting brazing is analyzed and the technological factors that influence on the brazing are expounded.The voids free chips after brazing are gotten through controlling these factors.The possible applications of vacuum brazing are described.更多还原