【摘要】 采用球栅阵列芯片尺寸封装技术和倒装芯片(Flip Chip,FC)技术构建了半桥集成电力电子模块(Integrated Power Electronics Module,IPEM),半桥FC-IPEM实现三维封装结构。采用阻抗测量法提取模块寄生电感和寄生电容,建立模块的寄生参数模型,对模块进行电气性能测试。结果表明:半桥FC-IPEM构成的同步整流Buck变换器输出滤波电感中的电流波动幅度小于0.6A。更多还原

【Abstract】 A half bridge integrated power electronics module using flip chip technology(HB FC-IPEM) and ball grid array chip scale package technology was constituted.In the HB FC-IPEM,three-dimensional package structure was accomplished.Impedance measurement was used to extract the parasitic inductances and capacitances for building the parasitic parameter model of the HB FC-IPEM.Electrical performance of the module was tested.Results show that the current waving amplitude of synchronous rectification Buck converter output filter inductor constituted by HB FC-1PEM is less than 0.6 A.更多还原