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电镀铜添加剂的合成及其电化学性能
Synthesis and Electrochemical Properties of a Copper Plating Additive
【摘要】 以N-乙烯基咪唑单体为原料,通过自由基引发聚合,合成了聚N-乙烯基咪唑。以聚N-乙烯基咪唑为中间体合成了聚溴化N-乙烯基-N′-丁基咪唑。通过红外光谱仪、核磁共振仪及元素分析仪对其结构进行了表征。采用阴极极化曲线、交流阻抗谱测试其电化学性能,并将该物质作为电镀铜添加剂。结果表明,该阳离子高分子化合物能够增大阴极极化,降低铜离子在阴极析出电位,获得晶粒细致、光亮平整的镀层,是良好的印刷电路板电镀铜的添加剂。
【Abstract】 Poly(N-vinylimidazole) was prepared by free radical polymerization of N-vinylimidazole,followed by its reaction with n-Butylbromide to obtain Poly(N-vinyl-N′-butyliimidazoliniumbromize).The structure was characterized by IR,HNMR and EA.The electrochemical properties were evaluated by cathodic polarization curve and EIS spectrum.The results indicate that the cation polymer compound can promote the copper cathode to be polarized and decrease the reduction potential of copper ion so as to make the copper grain reduced in size and more uniform and brighter.As a result,Poly(N-vinyl-N′-butylimidazoliniumbromize) may be a kind of perfect additive applied in copper plating of printed circuit board.
【Key words】 Poly(N-vinyl-N′-butylimidazoliniumbromize); copper plating; additive; cathodic polarization;
- 【文献出处】 电镀与精饰 ,Plating & Finishing , 编辑部邮箱 ,2009年02期
- 【分类号】TQ153.14
- 【被引频次】9
- 【下载频次】1069