节点文献
芯片凸点植球技术
Technology of Chip Bump Ball Mounting
【摘要】 介绍了目前芯片封装过程中凸点的几种制造方法,重点介绍了凸点植球技术的发展现状,以及相关制造设备的情况。
【Abstract】 This article briefly describes the current process of bump chip package of several manufacturing methods,with focus on the bump bumping technology development status,as well as the associated manufacturing facilities.
- 【文献出处】 电子工业专用设备 ,Equipment for Electronic Products Manufacturing , 编辑部邮箱 ,2009年12期
- 【分类号】TN405.96
- 【被引频次】2
- 【下载频次】143