【摘要】 采用无焊料电弧焊方法对Ti3AlC2陶瓷与Cu(Mg)合金进行焊接。观察分析了接头组织结构和物相组成,测试了焊接试样的弯曲强度。结果表明,Ti3AlC2陶瓷和Cu(Mg)合金之间具有良好的可焊接性。在适当的焊接工艺下,接头具有典型显微结构:在靠近Cu(Mg)合金的区域,自生成的细小TiCx颗粒均匀弥散在Cu(Ti,Al,Mg)合金网络内;在靠近Ti3AlC2陶瓷的区域,形成TiCx相与Cu(Ti,Al,Mg)合金相交替层叠的特殊结构。焊接试样的断裂发生在Ti3AlC2陶瓷部分,表明接头的抗弯强度高于被焊接的Ti3AlC2陶瓷材料。更多还原

【Abstract】 The arc welding of Ti3AlC2 ceramic to Cu(Mg) alloy was carried out without solder. The microstructures and phase compositions of joints were analyzed,and the flexural strengths of welded samples were also tested. The results showed the good weldability of Ti3AlC2 ceramic to Cu(Mg) alloy. In the proper welding technics,the joints had typical microstructures:in the zones adhered to Cu(Mg) alloy,self-generated micro TiCx particles were uniformly dispersed in the network of Cu(Ti,Al,Mg) allloys. While in the zones adhered to Ti3AlC2 ceramic,the TiCx layers and Cu(Ti,Al,Mg) alloy layers were alternately stacked. The failures of welded samples occurred in Ti3AlC2 ceramic substrate,which indicated that the flexural strength of joints exceeded that of the welded Ti3AlC2 ceramic.更多还原