【摘要】 为了确立最佳的碱性CuCl2蚀刻工艺条件,提高工作效率,采用烧杯静态吊片蚀刻法,研究了影响蚀刻速率的因素。主要研究结果如下:1)在蚀刻时间为5min时,单因素试验得出的适宜的工艺范围为:Cu2+的质量浓度约为140~180g/L,Cl-的质量浓度为4.8~6.5mol/L,pH为8.2~9.0,操作温度为48~55℃;2)正交试验结果表明,在Cu2+的质量浓度为160g/L,Cl-的质量浓度为5.5mol/L,pH为8.8,操作温度为50℃时,蚀刻状态最好,静态蚀刻速率可达到5.84μm/min。更多还原

【Abstract】 In order to establish the optimal etching process conditions of alkaline copper chloride to improve work efficiency,static spray etching methods were used to study the influencing factors of the etching rate.The main results were shown as following:(1) When the etching time is up to 5 minutes,the single factor experiment obtains the synthesis optimum condition: the concentration of copper ion about 140~180g/L,the concentration of chlorine 4.8~6.5mol/L,pH 8.2~9.0,the operating temperature 48~55℃.(2) The orthogonal experimental results show that the rate of static etching is up to 5.84μm/min,when the concentration of copper ion is 160g/L,the concentration of chlorine 5.5mol/L,pH value 8.8,the operating temperature 50℃.更多还原