【摘要】 整理和归纳了各国不同的RoHS相关政策,并分门别类地概括和介绍了各种符合环保法规的封装技术和材料的发展与动态,包括电子元件的环境对应、环境调和型印制电路板技术、低温导电技术、导电性粘结剂、易解体电子产品、CO2减排技术等,并对封装材料日后的环境适应历程进行了预测。更多还原

【Abstract】 Different versions of RoHS-related policies from different countries are collated and summed up,and the development on various kinds of packaging technology and materials are summarized based on environment conscience,including the environment corresponding of electronic components,the environment conscious printed circuit board technology,low-temperature conductivity technology,conductive adhesive,resoluble electronic products and carbon dioxide emission reduction technology.Finally,the future development of the environment conscious electronic package are pointed out.更多还原