【摘要】 随着平板显示器大型化、薄型化、高分辨率的发展趋势,对平板显示器封装技术提出了更高的要求。ACF符合电子线路封装精细化、集成化的发展要求,目前已广泛应用于平板显示器(例如LCD)的封装领域。综述了ACF应用于平板显示器封装的主要形式如TCP、COF、COG,分析了各种不同封装形式对ACF提出的不同性能要求,以及为了满足这些要求对ACF中导电粒子的大小、含量、硬度以及ACF中使用树脂的种类等方面进行结构性能改进的最新进展。更多还原

【Abstract】 With the development trends toward to large-scale,low-profile,high-resolution of flat panel display,it needs high requirement for flat panel display packaging technology.Anisotropic conductive films(ACF)are realized to meet the requirement of fine pitch capability and are widely used in FPDs(flat panel displays)packaging technologies so far.Various packaging technologies such as TCP(tape carrier package),COF(chip on flex)and COG(chip on glass)using ACFs are summarized.Different requirements for ACFs used in the packaging technologies are analyzed,and the recent advances in structure and performance improvement of ACFs are pointed out,such as the size,hardness,content ratio of conductive particles and the type of resin used in ACF.更多还原