【摘要】 试验研究了Sn-8Zn-3Bi无铅钎料在温度为55～100℃、压力为9.3～18.6MPa范围内的压蠕变行为。结果表明,随温度和应力的升高,合金的压蠕变量增大,稳态蠕变速率的对数分别与应力的对数和温度呈线性关系。在试验温度下,应力指数n相近,平均值为3.82;在不同的应力下,表观激活能Qa相差不大,平均值为80.68kJ/mol。材料结构常数A为6.83×104。压蠕变变形是位错滑移和位错攀移共同作用的结果。更多还原

【Abstract】 The compressive creep behavior of Sn-8Zn-3Bi lead-free solder was investigated at the temperature range of 55～100 ℃ and compressive stresses between 9.3～18.6 MPa.The results show that the creep increases with increasing temperature and compressive stress.There is a linear logarithmic relationship between the steady creep rate and the temperature or the stretss.The stress exponent is similar at different temperatures,and the average value is 3.82;the appearance activation energy has not large difference under different stresses,and the average appearance activation energy is 80.68 kJ/mol.Materials constant A is 6.83×104.The compressive creep deformation of Sn-8Zn-3Bi is caused by the combination of dislocation gliding and climbing.更多还原