【摘要】 用Ag-Cu-Ti活性钎料对C/SiC复合陶瓷与Nb合金进行了真空钎焊。结果表明,适合该陶瓷钎焊的Ag-Cu-Ti钎料的Ti含量以2.5%～3.0%(质量分数)为宜;但Ag-Cu-Ti2.5钎料直接钎焊陶瓷与金属,焊缝及陶瓷一侧有裂纹和孔洞等缺陷;钎料中引入Mo颗粒后有效缓解了残余应力,实现了陶瓷与金属的气密连接,界面反应产物主要是TiC,TiSi,Cu4Ti,Cu3Ti。更多还原

【Abstract】 The C/SiC ceramic was brazed to Nb alloy in vacuum using Ag-Cu-Ti brazing alloys. The results showed that the 2.5%～3.0%Ti (mass fraction) in brazing alloy was advisable for brazing C/SiC ceramic. However C/SiC could not be bonded reliably to Nb alloy straight using Ag-Cu-Ti2.5 because of high residual stress. In practice,the AgCuTi2.5-Mo material could joint them and the joint was highly gastight,depending on the 40%Mo (volume fraction) grains which could distinctly release the thermal stress,and the main reaction products were TiC,TiSi,Cu4Ti,Cu3Ti.更多还原