【摘要】 针对工件动态到达、批处理、可重入、生产时间离散化、多品种混合生产的半导体生产线问题,在约束理论五步原则的基础上,提出了基于约束理论动态规划调度模型。上层整数规划层依据约束理论制定生产计划,中层缓存控制层采用鼓-缓冲器-绳子策略,工件投放顺序策略控制在制品数量和平衡能力受限资源的生产能力,下层设备控制层采用启发式规则设计机器加工策略。通过以上分层规划调度的方法逐层实现了半导体生产线利润最大化、在制品库存最小化和生产流程时间最小化的多目标优化,并通过实例验证规划调度模型的有效性。更多还原

【Abstract】 For semiconductor wafer fabrication(SWF) problems with arriving dynamically,batch processing,reentrance,discrete producing time,multiple parts produced with each other.And then a planning and scheduling model based on Theory Of Constraint(TOC) was proposed based on the five principle steps of TOC.In the upper layer an integer programming was adopted based on TOC to establish producing plan.The middle layer was buffer controlling of bottleneck,in this layer Drum—Buffer-Rope(DBR) and a job selecting rule on the job-release time were adopted to control the Work In Process(WIP) and balance the Capacity Constraint Resources(CCR).The bottom layer scheduled the process of machine,which adopted simple heuristic rules.The multiple optimization objectives with the throughout of SWF maximized,the WIP minimized and the process time minimized were realized step by step through adopting layered planning and scheduling algorithm.And the effective of the planning and scheduling algorithm was analyzed by example study.更多还原