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Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

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【作者】 赵涣凌赵贺冯吉才宋敏霞赵熹华

【Author】 Zhao Huanling,Song Minxia and Zhao Xihua,School of Materials Science and Engineering,Jilin University,Changchun,130022. Zhao He and Feng Jicai,State Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin,150001

【机构】 School of Materials Science and Engineering Jilin UniversityState Key Laboratory of Advanced Welding Production TechnologyHarbin Institute of TechnologySchool of Materials Science and EngineeringJilin UniversityChangchun130022Harbin150001

【摘要】 The diffusion bonding was carried out to join Ti alloy(Ti-6Al-4V) and tin-bronze(ZQSn10-10) with Ni and Ni+Cu interlayer.The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope(SEM),energy dispersive spectroscopy(EDS) and X-ray diffraction(XRD).The results show that when the interlayer is Ni or Ni+Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds(Cu3Ti,CuTi etc.).But the Ni-Ti intermetallic compounds(NiTi,Ni3Ti) are formed on the Ti-6Al-4V/Niinterface.When the interlayer is Ni,the optimum bonding parameters are 830℃/10 MPa/30min.And when the interlayer is Ni+Cu,the optimum bonding parameters are 850℃/10MPa/20min.With the optimum bonding parameters,the tensile strength of the joints with Ni and Ni+Cu interlayer both are 155.8MPa,which is 65 percent of the strength of ZQSn10-10 base metal.

【Abstract】 The diffusion bonding was carried out to join Ti alloy(Ti-6Al-4V) and tin-bronze(ZQSn10-10) with Ni and Ni+Cu interlayer.The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope(SEM),energy dispersive spectroscopy(EDS) and X-ray diffraction(XRD).The results show that when the interlayer is Ni or Ni+Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds(Cu3Ti,CuTi etc.).But the Ni-Ti intermetallic compounds(NiTi,Ni3Ti) are formed on the Ti-6Al-4V/Niinterface.When the interlayer is Ni,the optimum bonding parameters are 830℃/10 MPa/30min.And when the interlayer is Ni+Cu,the optimum bonding parameters are 850℃/10MPa/20min.With the optimum bonding parameters,the tensile strength of the joints with Ni and Ni+Cu interlayer both are 155.8MPa,which is 65 percent of the strength of ZQSn10-10 base metal.

【基金】 The work was supported by National Natural Science Foundation of China(No50375065);State Key Laboratory of Advanced Welding Production Technology(No04005)
  • 【文献出处】 China Welding ,中国焊接(英文版) , 编辑部邮箱 ,2008年01期
  • 【分类号】TG457.1
  • 【被引频次】4
  • 【下载频次】88
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