【摘要】 引线键合是集成电路第一级组装的主流技术,也是电子器件迅速发展的一项关键技术,但应用于引线互连技术还有许多有待研究的问题。介绍引线键合的主要失效形式、影响因素、焊点可靠性、爆裂问题以及研究方法等,提出今后的研究方向,为进一步研究引线键合封装结构提供了重要参考。更多还原

【Abstract】 Wire bonding is the first-level assembly technology for integrated circuits and is essential technology for the fast development of electronic devices,but it has many issues to be researched in the wire bonding technology.The wire bonding technology,possible failure from,affect factors,solder security,crack and study methods have been reviewed.The contents will be referenced for the improvement of long-term reliability of wire bonding.更多还原