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复合型裂纹扩展过程的温度场分析
Temperature Field Analysis of Mixed Mode Crack During Propagation
【摘要】 针对实际工程结构中广泛存在的Ⅰ-Ⅱ复合型裂纹,以有限元软件ANSYS为平台,采用能量释放率准则作为判定依据,模拟了复合型裂纹的扩展路径;将裂纹扩展过程中裂尖前面耗散的塑性功视为内热源,采用热-力耦合方法,分析了扩展过程中的裂尖温度场变化,讨论了预制裂纹角对裂尖起裂塑性区和起裂温度的影响。通过与红外热像仪记录的实验结果进行对比,发现有限元模拟结果与实验结果一致。
【Abstract】 Ⅰ-Ⅱ mixed-mode fractures of material in practical engineering were considered.Using ANSYS software,the energy release rate was used as the fracture criterion to infer the propagation path of compound crack;regarding the plastic work dissipated ahead of the running crack as inner heat source,the crack tip temperature field was simulated by performing coupled thermal-mechanical finite element analysis.The influence of prefabricated crack angle on crack tip initiation plastic zone and crack initiation temperature was discussed.The finite element analysis results were compared with the experimental data recorded by an infrared thermograph,and a good match was obtained.
【Key words】 Ⅰ-Ⅱ mixed mode crack; crack propagation; energy release rate; infrared thermography; temperature field;
- 【文献出处】 武汉理工大学学报 ,Journal of Wuhan University of Technology , 编辑部邮箱 ,2008年04期
- 【分类号】O346.1
- 【被引频次】2
- 【下载频次】252