节点文献
大功率白光LED的封装技术研究
Research on Encapsulation Technology of Large Power White-Light LED
【摘要】 研究了40 mil×40 mil瓦级大功率白光LED封装的关键技术,采用1W的蓝光芯片加YAG荧光粉封装的白光LED,在350 mA的恒定电流驱动下,获得了130.3lm的发光通量,发光效率达108.6lm/W,显色指数约为91.5。
【Abstract】 The key encapsulation technology of 40mil×40mil large power white-light LED has been researched. The white light LED was encapsulated by covering YAG fluorescence powder on the surface of blue-light chip. In the invariable driving current of 350mA, the luminous flux is 130.3lm and the emitting efficiency is 108.6lm/W. The color rendering index is about 91.5.
【关键词】 功率型LED;
封装;
白光;
光衰;
发光效率;
【Key words】 power LED; encapsulation; white-light; luminous decay; luminous efficiency;
【Key words】 power LED; encapsulation; white-light; luminous decay; luminous efficiency;
- 【文献出处】 上海第二工业大学学报 ,Journal of Shanghai Second Polytechnic University , 编辑部邮箱 ,2008年03期
- 【分类号】TN312.8
- 【被引频次】4
- 【下载频次】598