【摘要】 随着微电子工业的发展,导电胶替代传统的锡铅焊料已经成为一种发展趋势,本文介绍了各向异性导电胶(ACA)的组成和分类、3种导电机理及国内外导电胶的研究现状和发展方向,特别是在各向异性导电胶填料表面功能化处理方面的研究现状和在液晶显示屏(LCD)、发光二极管(LED)组装应用上的进展。更多还原

【Abstract】 With the development of microelectronics industry,it is a tendency that electrically conductive adhesive is an alternative of traditional tin-lead solder.This paper introduced the composition and classification,three acceptable electrically conductive mechanisms,current status and development direction of research and applications of the anisotropic conductive adhesives,especially,the filler surface functional treatment and the application progress in liguid crystal display(LCD) and light emitting diode(LED) assembly.更多还原