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新型耐高温聚酰亚胺模塑料的制备与性能研究

Preparation and Performance Study of New Type of High Temperature Resistant Polyimide Moulding Compounds

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【作者】 张晓蕾周海军肖继君李彦涛

【Author】 ZHANG Xiao-lei1,ZHOU Hai-jun1,XIAO Ji-jun2,LI Yan-tao1(1. Energy Resources Institute of Heibei,Shijiazhuang 050081,China;2.Hebei University of Science and Technology,Shijiazhuang 050054,China)

【机构】 河北省能源研究所河北科技大学

【摘要】 采用均苯二酐(PMDA)和双醚二酐(HQDPA)与对苯二胺(PDA)通过两步法制备了一系列二酐不同配比的耐高温聚酰亚胺模塑料,并对其力学性能和热性能等进行了测试表征。研究表明,随双醚二酐含量的增加,聚酰亚胺模塑料的拉伸强度和断裂伸长率均有提高;热失重(10%)分解温度为600℃左右,玻璃化转变温度可达317℃,具有很好的耐热性能。

【Abstract】 A serious of high temperature resistant polyimide moulding compounds with different ratios were prepared from pyromellitic acid dianhydride(PMDA),hydroquinone diphthalic anhydride (HQDPA) and p-Phenylenediamine(PDA) through two-step method. The mechanical properties and thermal stability of the PI moulding compounds were investigated. The study results show that the tensile strength and breaking elongation rate are improved with the increasing of HQDPA content. The temperature of obvious thermal weight loss decomposition is about 600 ℃ and the glass transition temperature can reach 317 ℃. The new type of PI moulding compound has better thermal resistance property.

【关键词】 双醚二酐对苯二胺聚酰亚胺模塑料性能
【Key words】 HQDPAPDApolyimidemoulding compoundproperty
  • 【文献出处】 绝缘材料 ,Insulating Materials , 编辑部邮箱 ,2008年03期
  • 【分类号】TQ320
  • 【被引频次】2
  • 【下载频次】308
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