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钼粉表面超声波化学镀铜
Ultrasonic Electroless Copper Plating on the Surface of Mo Powders
【摘要】 利用超声波对钼粉末进行化学镀铜,并探讨了镀液组成及工艺条件对钼粉末化学镀铜的影响。利用X射线衍射判断相组成,用扫描电镜观察镀覆结果。结果表明:引入超声波并调整镀液组成和工艺条件可以实现钼粉表面化学镀铜,施镀过程中保持了镀液的稳定性,同时对复合粉末进行了有效的分散;以EDTA和酒石酸钾钠为络合剂,并加入聚乙二醇和2,2’-联吡啶作为稳定剂,可以有效地消除复合粉末中的Cu2O。通过严格控制pH值、温度和甲醛浓度可以获得质量好的铜镀层。
【Abstract】 A new process,which includes electroless copper plating on Mo powders with ultrasonic,was developed for the preparation of Mo-Cu composite powders.The influence of the solution composition and plating conditions on electroless copper plating of Mo powders has been studied.The results were examined by SEM and XRD.The results indicate that by introducing the ultrasonic and adjusting the composition and condition of plating,the electroless copper plating on molybdenum powder substrates is obtained,the bath keeps steady and composite powders are dispersed effectively.With EDTA and potassium sodium tartrate as complexing agent and polyethylene glycol and 2,2’-bipyridyl as stabilizers the Cu2O can be eliminated effectively.The high quality copper coating can be acquired by controlling pH value,temperature and formaldehyde concentration.
- 【文献出处】 金属功能材料 ,Metallic Functional Materials , 编辑部邮箱 ,2008年02期
- 【分类号】TQ153.14
- 【被引频次】4
- 【下载频次】221