【摘要】 本文探索了以0.5~1.5μm金刚石微粉为原料,烧结PCD复合片。在5.2 GPa条件下,烧结温度在1 350~1 500℃范围内,利用分层组装和混合钴粉的方法烧结并进行比较。实验结果表明:采用分层组装比混合10 wt%钴粉的方法更容易成型,其努普硬度最大值为56.12 GPa,并且硬度随着温度的升高而增加,同时在1 500℃时伴随石墨相的出现。分层组装扫描电镜结果显示,随着温度的增加,其结构趋于均匀化,表面已经形成大面积的D-D结合,且其断面钴含量与距离碳化钨基体的距离有关。X射线衍射图谱显示:在1 500℃时开始出现石墨相,并且钴在复合片里以钴的β相存在。更多还原

【Abstract】 Fine grain PCD compacts with 0.5~1.5 μm diamond powder as starting materials were studied under pressure of 5.2 GPa and temperatures 1 350~1 500 ℃.Layered method and cobalt-mixed powder methods were used and compared in this paper.The results indicated that: layered method was better.The hardness increased with sintering temperatures and reached the highest value 56.12 GPa at 1 500 ℃.SEM results indicated that microstructure was more homogeneous with sintering temperatures increasing,and D-D direct bonding could be got in more areas with layered method.The content of cobalt in diamond layers is related to the distance from tungsten carbide.XRD results indicated that graphite appeared at 1 500 ℃,and the cobalt existed in the phase of β-cobalt.更多还原