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Ductility of metal thin films in flexible electronics

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【Author】 NIU RongMei, LIU Gang, DING XiangDong & SUN Jun State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science & Engineering, Xi’an Jiaotong University, Xi’an 710049, China

【摘要】 Flexible, large area electronics using various organic and inorganic materials are beginning to show great promise. During manufacture and service, large deforma- tion of these hybrid materials will pose significant challenges in terms of high performance and reliability. A deep understanding of the ductility or flexibility of macroelectronics becomes one of the major issues that must be addressed ur- gently. This paper describes the current level of understanding on the thin-film ductility, both free-standing and substrate-supported, and relevant influencing factors.

【Abstract】 Flexible, large area electronics using various organic and inorganic materials are beginning to show great promise. During manufacture and service, large deforma- tion of these hybrid materials will pose significant challenges in terms of high performance and reliability. A deep understanding of the ductility or flexibility of macroelectronics becomes one of the major issues that must be addressed ur- gently. This paper describes the current level of understanding on the thin-film ductility, both free-standing and substrate-supported, and relevant influencing factors.

【关键词】 thin filmsdeformationflexible electronics
【Key words】 thin filmsdeformationflexible electronics
【基金】 the National Basic Research Program of China (Grant No. 2004CB619303);the 111 Project of China (Grant No. B06025);the Science and Technology Key Project from Ministry of Education of China (Grant Nos. 02182, 03182)
  • 【文献出处】 Science in China(Series E:Technological Sciences) ,中国科学(E辑:技术科学)(英文版) , 编辑部邮箱 ,2008年11期
  • 【分类号】TB383.2
  • 【被引频次】1
  • 【下载频次】58
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