【摘要】 通过增重法研究了250℃下微量合金元素P的添加对液态Sn-8Zn-3Bi焊料表面氧化行为的影响。试验借助扫描电镜(SEM)、俄歇电子能谱(AES)等分析方法探索磷的抗氧化机理。比较了氧化前后焊料的力学性能及铺展性能差异,探讨合金元素P的加入对焊料其它性能的影响。结果表明,磷的加入对Sn-8Zn-3Bi焊料的抗氧化性具有明显的改善作用。磷替代了锌优先被氧化,在焊料表面形成了易于挥发的P4O6氧化膜。当合金中P元素含量为0.2%(质量分数)时,焊料的综合性能最佳。更多还原

【Abstract】 The effect of alloying P on oxidation behavior of the liquid Sn-8Zn-3Bi lead-free solder at 250 ℃ was investigated by thermogravimetry experiment. The effect mechanism of P on the oxidation was discussed by scanning electronic microscopy(SEM) and auger electronic spectroscopy (AES) in experiments. Properties were compared between before after oxidation to explore the effect on solders’ other properties. The results indicate that P can improve the oxidation resistance of Sn-8Zn-3Bi obviously. P was oxidized which is prior to Zn. A oxide film consisting of P4O6 which was tend to volatilize formed on the surface of the solder. The over-all properties of the solder is best with the addition of 0.2wt.%P.更多还原