【摘要】 采用粉末冶金技术成功制备了La含量为x(其中x=0.1%~0.5%)的无铅焊料Sn-9Zn-xLa,应用DTA,SEM,XRD等技术分析了焊料的熔点,形貌,微结构,成分,焊料与Cu基板的粘附性等性能,并获得这些性能随La添加量而变化的规律.研究表明:添加微量稀土元素La能较大程度的改善无铅焊料润湿等方面的性能,Sn-9Zn-xLa有望替代传统PbSn合金,成为微电子器件封装焊接材料.更多还原

【Abstract】 Sn-9Zn eutectic solder alloy is a potential candidate to replace 63Sn-37Pb alloy as interconnecting material in electronic packaging industry.But the inferior wettalility make this alloy not suitable for application widely.Sn-9Zn alloy added different La contents(0.1%-0.5%) were prepared by powder metallurgy.DTA,SEM and XRD were used to test and analyse performance of the solders accurately.Results show that the additional La in Sn-Zn-xLa solders would enhance the products performance in many aspects,such as melting point,wettability,morpha and so on.Sn-Zn-xLa may be a more appropriate candidate in industry.更多还原