【摘要】 研究了在Sn-58Bi合金中添加少量Al后对合金性能、恒温时效焊点组织稳定性及接头界面处金属间化合物层生长的影响。研究结果表明:在80℃时Sn-58Bi合金具有稳定的组织结构,但超过100℃Bi相会异常粗化,导致合金性能变差。在100℃恒温时效试验中,Al能有效抑制Bi相的粗化,接头界面处IMC层的生长呈减缓趋势。随着Al含量的增加,Sn-58Bi-Al系合金的拉伸强度增大,铺展性有所降低。更多还原

【Abstract】 The effects of Al addition to Sn-58Bi alloy on the properties and the structural stability of the solder,and IMC growth at the interface under isothermal aging condition have been studied.The structural of Sn-58Bi solder is stable at 80 ℃.However,Bi phase of Sn-58Bi solder is coarsened above 100 ℃ which results in poor properties.The addition of Al reduces the coarsening rate of Bi ageing at 100 ℃.Meanwhile,the trend of IMC growth is slowed down on the solder joint.With the increase of Al,the tensile strength of the alloy raises;at the meantime,spreading property of the alloy decreases.更多还原