【摘要】 多芯片组件MCM(Multi Chip Module)是近年来迅速发展的一种电子封装技术。随着芯片封装密度的增加,计算机辅助设计CAE技术对其可靠性进行仿真分析显得越来越重要。文章综合介绍了ANSYS软件在MCM器件仿真设计中的最新应用进展,然后详细介绍了ANSYS软件在MCM封装、焊点疲劳和跌落分析中的应用情况。更多还原

【Abstract】 The packaging technology of multi chip module is an important developing direction in micro-electronic packaging technology in the future. With the development of die package density increasing,the computer aid engineering( CAE) for MCM reliability analysis becomes more and more important. In this paper,the new development of MCM design by ANSYS software simulation is discussed. The functions of ANSYS and its applications in the MCM packaging,sold fatigue,and drop test are introduced in details.更多还原