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轧制复合工艺制备发泡预制体的结合机制
Study on Bonding Mechanism of Foaming Precursor Prepared by Roll-Bonding Technology
【摘要】 将轧制复合工艺应用于发泡预制体的制备,研究了粉末致密化过程与面板/芯层的结合机制。结果表明:轧制复合工艺可使芯层粉末获得理想的致密度,压下率为67%时,粉末的相对密度可达99.87%,较适宜的压下率为60%~70%。轧制作用下,粉末致密化的机制为机械结合。压下率较小时,发生粉末的流动、剪切;压下率较大时,粉末在进入变形区后瞬间即被压实。面板/粉末的结合方式为粉末颗粒对面板表面的填充、塞积。
【Abstract】 The technology of roll-bonding was applied to prepare the foaming precursor in this paper.The densification of powder and the bonding mechanism of face panel/core powder were investigated.The results show that the roll-bonding technology enables the core powder to get ideal densification.When the reduction rate is 67%,the relative density of powder can reach 99.87%.The optimizing reduction rate should be controlled at 60%~70%.Mechanical bond is the mechanics of powder densification under rolling.When reduction rate is small,the flowing and shearing of the powder occur;when reduction is large,the powder will be compacted while it enters the deformed area.The bonding way of panel/powder is powder particle filling into the face panel.
【Key words】 foaming precursor; roll-bonding; powder; densification; mechanical bond;
- 【文献出处】 稀有金属材料与工程 ,Rare Metal Materials and Engineering , 编辑部邮箱 ,2008年03期
- 【分类号】TG335
- 【被引频次】4
- 【下载频次】143