【摘要】 对石墨与铜采用非晶态TiZrNiCu钎料进行了真空钎焊。采用光学显微镜(OM OLMPUS)、扫描电镜(SEM,S-4700)、电子探针(EPMA,JXA8600)等分析手段对接头的界面微观组织进行观察分析,研究结果表明,钎缝中主要是金属间化合物生成相,如Cu-Ti,Cu-Zr,Ni-Ti系等,裂纹易产生于焊缝中尺寸较大的一个金属间化合物相上,Cu基固溶体的存在可以阻碍或延缓裂纹的扩展,对提高接头性能有利。在该实验条件下在950℃/15min工艺参数下获得的接头的电阻率低于5 mΩ,平均电阻为3.3mΩ,接头的抗剪强度为16.34MPa满足该接头作为换向器接头的使用要求。更多还原

【Abstract】 Graphite was joined to copper using amorphous TiZrNiCu filler foil by vacuum brazing.Joint interface was analyzed by several methods,such as optical microscope,SEM,EDS and EPMA.The results showed that Cu-Ti,Cu-Zr and Ni-Ti compounds distributed on the interface and cracks tended to occur at large-size compounds.Cu-based solid solution can prevent or slow down the crack propagation,which is favorable for the joint strength.When the joint is brazed at 950℃ for 5min,the resistance of joint is below 5 mΩ and the average resistance is 3.3mΩ,while the joint shear strength reaches 16.34MPa.All of these meet the demand of the joint as a diverter.更多还原