【摘要】 随着微电子技术的高速发展,金刚石/金属复合材料作为新一代的电子封装材料受到了广泛的重视,它与传统的电子封装材料相比,具有更优异的性能,是未来封装、热沉材料最有潜力的发展方向之一。对金刚石/金属复合材料的性能、制备工艺及应用发展进行了综述,并提出了未来的研究开发方向。更多还原

【Abstract】 With the rapid development of microelectronic technology,diamond/metal composites as a new generation electronic packaging material have received more and more attention.Diamond/metal composites have more outstanding performance than the traditional electronic packaging materials.They have the most development potential to be the new generation electronic packaging,heat sink materials.This paper overviews the properties,manufacturing process and applications of diamond/metal composites,and points out the problems to be resolved in the future.更多还原