【摘要】 针对集成电路圆片级测试需要,利用MEMS技术设计制作了一种悬臂梁式芯片测试探卡。每个悬臂梁在设计时可以承受25mN的探测力,同时使探针针尖产生20μm以上的位移。通过独特的双面金属覆盖设计,电学测试信号可以成功地从位于硅悬臂梁下方的探针针尖,引到位于玻璃上层的封装焊盘,并进而与自动测试仪器连接。由于采用了二次台阶的结构设计,相邻探针之间可以实现金属自隔断。初步测试表明,探针针尖到引线的电阻值在0.8Ω以下,而相邻探针之间的绝缘电阻则高达500GΩ。硅悬臂梁的弹性系数为1126.8Nm-1,与设计值相吻合。更多还原

【Abstract】 Based on advanced MEMS technology,a novel cantilever type probe card is designed and fabricated to meet the technical requirement of IC wafer-level testing.Each cantilever is designed to withstand a probing force of 25mN,with a tip displacement of no less than 20μm.By using a specific double-sided metal overlapping scheme,electric feed-through is realized from the probe tips on the bottom of silicon cantile-ver,to the packaging pads on the top of glass wafer which are further connected to the automatic testing equipment.Adjacent cantilevers are self-isolated by a recessed concave step when metal layer is sputtered on the surface of the cantilever tips.Preliminary test shows that via resistance between the probe tip and the packaging pad is lower than 0.8Ω,while the isolation resistance between adjacent probes is higher than 500 GΩ.The spring constant of the silicon cantilever is measured as 1126.8 Nm-1,which agrees well with the design value.更多还原