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非晶硅薄膜的红外热敏特性
Thermal Sensitive Characteristics of Phosphor-Doped Hydrogenated Amorphous Silicon by PECVD
【摘要】 用PECVD技术制备了不同掺磷比的非晶硅薄膜,然后退火改性.红外透射光谱揭示了薄膜内部的键合模式随生长工艺条件变化的规律;测量和分析了非晶硅红外热吸收及电阻温度系数与薄膜结构之间的关系.综合考虑非晶硅电阻率和电阻温度系数两个因素,采用掺杂比0.025,退火温度600℃的薄膜样品进一步研究.
【Abstract】 A hydrogenated amorphous silicon of different phosphor doping concentr ations is fabricated by PECVD.FTIR spectra and TCR of a-Si:H are obtained afte r annealing at different temperatures and times.The structure and bonding of the film are decided by different annealing conditions,leading to the change in th e thermal and electric characteristics.Lu’s model is used to explain the phenom ena,and an optimum preparation is attained with a doping ratio of 0.025 and an annealing temperature of 600℃.
【关键词】 非晶硅;
退火;
红外透射;
电阻温度系数;
【Key words】 amorphous silicon; annealing; FTIR; temperature coefficient resistance;
【Key words】 amorphous silicon; annealing; FTIR; temperature coefficient resistance;
【基金】 国家重点基础研究发展规划(批准号:2006CB300406);上海AM基金(批准号:0402)资助项目~~
- 【文献出处】 半导体学报 ,Journal of Semiconductors , 编辑部邮箱 ,2008年11期
- 【分类号】TN304.12
- 【被引频次】4
- 【下载频次】275