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840nm VCSEL阵列湿法氧化研究

Study on Wet Oxidation of 840 nm VCSEL Array

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【作者】 侯立峰钟景昌赵英杰郝永芹冯源谢浩锐姜晓光

【Author】 Hou Lifeng1,2,Zhong Jingchang1,Zhao Yingjie1,Hao Yongqin1,Feng Yuan1,Xie Haorui1,Jiang Xiaoguang1 (1.National Key Lab.on High Power Semiconductor Lasers,Changchun University of Science and Technology,Changchun 130022,China;2.Armor Technique Institute of PLA,Changchun 130117,China)

【机构】 长春理工大学高功率半导体激光国家重点实验室长春理工大学高功率半导体激光国家重点实验室 长春130022中国人民解放军装甲兵技术学院长春130117长春130022

【摘要】 湿法氧化工艺已经成为制备垂直腔面发射激光器(VCSEL)及其阵列的关键技术,为提高器件的散热性能,对单元器件采用环行分布孔的氧化窗口,优化设计了分布孔的数目与间距,同时从瞬态热传导方程对构成激光器阵列单元器件的热相互作用进行了理论的分析。采用湿法氧化工艺制备了840 nm、3×3二维VCSEL阵列,对阵列器件的光电特性、光谱及近场等进行了测量,证明器件性能良好。

【Abstract】 Wet oxidation is a key technology in fabrication of VCSEL and their array,in order to improve VCSEL thermal characteristics,devices with ring distributed perforations were made.The design of the number and the distance of the perforations were optimized.The thermal interaction between individual elements in lasers array were studied with the transient thermal conduction function.In the experiments,the 840 nm 3×3 2-D VCSEL array devices were fabricated through the wet oxidation technique,and the characteristics such as near field,emission spectrum,and output power were measured.It reveals that the devices are with good performance.

【基金】 国家自然科学基金资助项目(60306004)
  • 【文献出处】 半导体技术 ,Semiconductor Technology , 编辑部邮箱 ,2008年06期
  • 【分类号】TN248
  • 【被引频次】2
  • 【下载频次】174
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