【摘要】 以纯Al粉为渗剂、NHCl4作为活化剂、鸡蛋清为粘结剂、Cu基体镀Ni层表面渗Al。研究经800℃保温12 h后的渗铝层的表面形貌、组织、厚度和截面元素分布,分析渗铝过程的机理。结果表明:渗铝处理后Cu-Ni界面结合良好。渗铝层组织为单一的富Al的Ni2Al3金属间化合物。渗铝层厚度为200μm,平均显微硬度HV达到1 100。Al的沉积和运输主要依靠AlCl2完成。更多还原

【Abstract】 The surface of the electro-deposited nickel layer on copper matrix was aluminized by a slurry pack cementation process.Using aluminum powders as doner,NH4Cl as the activator and albumen(egg white) as the cohesive agent.The surface morphology,the thickness,the phases and the elements distribution in the cross-section of aluminized layer fabricated at 800 ℃ for 12 h were studied,and the aluminizing mechanism was discussed.The results show that the interface of the Cu/Ni is bound excellently after aluminization.The microstructure of the aluminized layer is a single-phase Ni-rich Ni2Al3 intermetallic compound.The thickness of aluminized coating was 200 μm.The average micro hardness of the aluminized layer is HV 1 100.AlCl2 is responsible for the transportation and deposition of Al in the slurry pack.更多还原