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电子封接用钼铜材料的制备

Preparation of Molybdenum-Copper Composite for Electronic Sealing

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【作者】 高广瑞刘海彦汤慧萍李增峰黄原平

【Author】 Gao Guangrui,Liu Haiyan,Tang Huiping,Li Zengfeng,Huang Yuanping(Northwest Institute for Nonferrous Metal Research,Xi’an 710016,China)

【机构】 西北有色金属研究院西北有色金属研究院 陕西西安710016陕西西安710016

【摘要】 通过扫描电镜、透射电镜及X射线衍射等对Mo-Cu复合粉末的粉末形貌、合金化程度及烧结后合金组织结构进行分析,研究了高能球磨后Mo-Cu材料的显微组织及其与陶瓷热膨胀性能匹配的关系。结果表明,采用高能球磨机械合金化和氢气气氛烧结工艺制备的Mo-Cu复合材料,相对密度在98%以上,在室温至700℃热膨胀系数与陶瓷差值在8%。

【Abstract】 The morphology and mechanical alloying extent of the molybdenum-copper composite powder and metallurgical structure of the sintered composite were analyzed by means of SEM,TEM and XRD。The microstructure of molybdenum-copper composite prepared by high-energy ball milling processing and the matching relationship of thermal expansion coefficient between the molybdenum-copper composite and the ceramic was studied.The results show that molybdenum-copper composite prepared by the processing of high-energy ball milling and hydrogen sintering has the relative density above 98%,and the D-value of thermal expansion coefficient between the Mo-Cu composite and ceramic is about 8% in the temperature range from room temperature to 700 ℃.

  • 【文献出处】 钛工业进展 ,Titanium Industry Progress , 编辑部邮箱 ,2007年05期
  • 【分类号】TF125
  • 【被引频次】5
  • 【下载频次】181
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